| 摘要 |
PROBLEM TO BE SOLVED: To prevent dispersion (splash) of an electric component during reflow treatment by making a blowdown air flow of hot wind or cool wind breeze.SOLUTION: The solder device comprises: a transport part for transporting a workpiece; and a solder treatment part for performing solder treatment of the workpiece. A blowdown nozzle attached to the solder device comprises: a plate member 11 having predetermined width and thickness; and plural long hole parts 12 having predetermined length in a direction orthogonal to the transport direction of the workpiece, and being arranged to the plate member with predetermined open width in the workpiece transport direction in a lattice state. |
