| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce such a risk that a workpiece cannot be processed at a uniform height position, and prevent damage of the workpiece itself.SOLUTION: In a method for adhering a tape on a surface 2 of a workpiece with unevenness, after the tape is adhered on a protrusion part on its surface, a surface protection tape 10 is sucked by a suction pad 13 and the surface protection tape 10 adhered to a recess part 6a is peeled from the recess part 6a while a rear face 3 of a wafer 1 is sucked and held by a holding table 7. Therefore, even when the surface protection tape 10 enters into a bottom of the recess part 6a, the surface protection tape 10 is peeled from the recess part 6a by the suction pad 13. Thus, even when a top surface 3 of the wafer is sucked and held during processing the rear face 3 of the wafer 1, the recess part 6a is not pulled. Therefore, such a risk that cut-processing or laser-processing cannot be applied to the wafer 1 at a uniform height position can be reduced, and such a risk that the wafer 1 itself is broken can be reduced.</p> |
