发明名称 RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE WITH PLATED LAYER
摘要 Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises, relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive,;wherein the laser direct structuring additive comprises a metal oxide particle comprising titanium oxide coated with a composition comprising tin as a main component and antimony.
申请公布号 US2015111041(A1) 申请公布日期 2015.04.23
申请号 US201314241634 申请日期 2013.09.12
申请人 MITSUBISHI ENGINEERING-PLASTICS CORPORATION 发明人 Motegi Atsushi;Maruyama Hiroyoshi
分类号 C08L69/00;C23C18/16;C23C18/20;C08K13/04;C23C18/38 主分类号 C08L69/00
代理机构 代理人
主权项 1. A resin composition for laser direct structuring, comprising, relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive comprises a metal oxide particle comprising titanium oxide coated with a composition comprising tin as a main component and antimony.
地址 Tokyo JP