| 发明名称 |
THERMOSETTING RESIN COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND METHOD OF PRODUCING THERMOSETTING ADHESIVE SHEET |
| 摘要 |
A thermosetting resin composition has good storage properties at room temperature and an unreacted epoxy resin etc. are less likely to exude therefrom during heat compression molding. The thermosetting resin composition contains an acrylic copolymer including an epoxy group-containing (meth)acrylate unit, an epoxy resin, and a curing agent for an epoxy resin. In this thermosetting resin composition, epoxy groups in at least the acrylic copolymer are partially cross-linked with an amine compound and a thiol compound having 2 to 4 thiol groups per molecule, and the curing agent for an epoxy resin is an organic acid dihydrazide. |
| 申请公布号 |
US2015111035(A1) |
申请公布日期 |
2015.04.23 |
| 申请号 |
US201314398607 |
申请日期 |
2013.05.28 |
| 申请人 |
DEXERIALS CORPORATION |
发明人 |
Motomura Daisuke |
| 分类号 |
C09J7/02 |
主分类号 |
C09J7/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermosetting resin composition comprising an acrylic copolymer including an epoxy group-containing (meth)acrylate unit, an epoxy resin, and a curing agent for an epoxy resin, wherein
epoxy groups in at least the acrylic copolymer are partially cross-linked with an amine compound and a thiol compound having 2 to 4 thiol groups per molecule, and the curing agent for an epoxy resin is an organic acid dihydrazide. |
| 地址 |
Tokyo JP |
