| 摘要 |
PROBLEM TO BE SOLVED: To provide a temperature control system for a semiconductor manufacturing facility, which can minimize power to be consumed for cooling and heating.SOLUTION: In a temperature control system 100 for mixing a low-temperature heating medium and a high-temperature heating medium to supply a heating medium (coolant) at a temperature based on a process recipe to a load 30 such as an electrostatic chuck (ESC) for supporting a wafer and maintaining a temperature in a chamber in which a semiconductor wafer manufacturing process is performed, the heating medium cooled through thermoelectric elements 130, 140 and the heating medium heated through a heater 240 are mixed with each other at a first ratio and a second ratio so that the temperature reaches a desired target temperature, the mixed heating medium is supplied to the load, and the heating medium collected from the load is distributively provided to the thermoelectric elements and the heater at the first ratio and the second ratio which are the same ratios as the mixing ratios. |
