发明名称 |
METHOD OF PRODUCING A COMPONENT CARRIER, AN ELECTRONIC ARRANGEMENT AND A RADIATION ARRANGEMENT, AND COMPONENT CARRIER, ELECTRONIC ARRANGEMENT AND RADIATION ARRANGEMENT |
摘要 |
A method of producing a component carrier for an electronic component includes a lead frame section including an electrically conductive material, the lead frame section having a first contact section that forms a first electrical contact element, a second contact section that forms a second electrical contact element, and a reception region that receives the electronic component, at least the reception region and the second contact section being electrically conductively connected to one another, a thermally conductive and electrically insulating intermediate element that dissipates heat from the reception region and electrically insulates the reception region formed at least on an opposite side of the lead frame section from the reception region, and a thermal contact that thermally contacts the electronic component formed at least on a side of the intermediate element facing away from the reception region. |
申请公布号 |
US2015108531(A1) |
申请公布日期 |
2015.04.23 |
申请号 |
US201314398557 |
申请日期 |
2013.05.07 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Schwarz Thomas;Grötsch Stefan;Zitzlsperger Michael |
分类号 |
H01L33/62;H01L33/64;H01L21/48;H01L23/495 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Regensburg DE |