| 摘要 |
A reliable semiconductor light-emitting device can include a mounting board, at least one semiconductor light-emitting chip mounted on the mounting board, a wavelength converting layer having a side surface covering the light-emitting chip, and a seal member having an opening contacting the side surface of the wavelength converting layer and covering chip electrodes. The light-emitting device can also include a transparent layer disposed into the opening of the sealing member so as to be located over the light-emitting chip and within a top surface of the light-emitting chip, and can be configured to emit various mixture lights having a high uniformity by using lights emitted from the light-emitting chip and the wavelength converting layer. Thus, the disclosed subject matter can provide the reliable light-emitting device, which can emit the mixture lights including a substantially white color light from a small light-emitting surface as a light source for a headlight, etc. |
| 主权项 |
1. A semiconductor light-emitting device comprising:
a mounting board having a mounting surface; at least one semiconductor light-emitting chip having a top surface, a side surface, a bottom surface and chip electrodes, including a semiconductor layer having the top surface and the side surface, and including a chip substrate having the top surface, the side surface and the bottom surface, each of the chip electrodes formed on either one of the top surface of the semiconductor layer or the bottom surface of the chip substrate, and the at least one semiconductor light-emitting chip being mounted on the mounting surface of the mounting board; a wavelength converting layer having a side surface including at least one phosphor, and covering at least the top surface and the side surface of the at least one semiconductor light-emitting chip; a sealing member having an opening mounted on the mounting surface of the mounting board, the opening of the sealing member located over the chip substrate of the semiconductor light-emitting chip in a direction substantially perpendicular to the top surface of the semiconductor layer, and located between the side surface of the chip substrate and the side surface of the semiconductor layer of the semiconductor light-emitting chip in a direction substantially parallel with the top surface of the semiconductor layer, the sealing member contacting with the side surface of the wavelength converting layer, the opening of the sealing member having a cutout section when at least one of the chip electrodes of the semiconductor light-emitting chip is formed on the top surface of the semiconductor layer of the semiconductor light-emitting chip, the cutout section of the opening projecting from the sealing member toward the opening, and the sealing member covering the at least one of the chip electrodes with the cutout section so as not to be exposed from the opening of the sealing member; a transparent layer disposed into the opening of the seal member; and wherein the top surface of the chip substrate of the at least one semiconductor light-emitting chip adjacent the sealing member projects from an end of the side surface of the semiconductor layer of the at least one semiconductor light-emitting chip adjacent the sealing member toward the sealing member, and the side surface of the wavelength converting layer is formed in a convex shape toward the sealing member. |
