发明名称 RESISTIVE RANDOM ACCESS MOMORY COMPRISING MULTI STACKED STRUCTURE, AND METHOD FOR FABRICATING THE SAME
摘要 <p>The present invention relates to a resistive random access memory comprising a memory layer of a stacked structure, and a method for fabricating the same. A resistive random access memory according to an embodiment of the present invention includes a first electrode; a memory layer formed on the first electrode; and a second electrode formed on the memory layer. The memory layer includes a first memory layer and a second memory layer. The oxygen content of the first memory layer is different from that of the second memory layer.</p>
申请公布号 KR101512728(B1) 申请公布日期 2015.04.23
申请号 KR20140120810 申请日期 2014.09.12
申请人 INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY 发明人 KIM, HYUN JAE;PARK, SUNG PYO;YOON, DOO HYUN;TAK, YOUNG JUN;LEE, HEE SOO
分类号 H01L27/115;H01L21/8247;H01L29/02 主分类号 H01L27/115
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