CIRCUIT MODULE, LIGHT-EMITTING MODULE, AND PRESSING MEMBER

摘要

In a circuit module, an element-mounting substrate (20) has a mounting portion on which a semiconductor light-emitting element is mounted, and an electrode portion (20b) through which current is supplied to the semiconductor light-emitting element. An FPC substrate has a conductive portion (22a1) through which current supplied to the electrode portion (20b) flows. A flat spring (24) has pressing portions (24a2) for pressing the conductive portion (22a1). The conductive portion (22a1) contacts the electrode portion (20b) by being sandwiched between the electrode portion (20b) and the pressing portions (24a2). The flat spring (24) may be a plate-shaped member having openings for exposing the mounting portion.