发明名称 |
PRODUCTION OF AN OPTOELECTRONIC COMPONENT |
摘要 |
The invention relates to a method for the production of an optoelectronic component. In said method, a number of optoelectronic semiconductor chips are arranged on a carrier. Further provision is made for a common compression of separate moulding compounds in the region of the optoelectronic semiconductor chips, allowing separate moulded bodies to be formed in the region of the optoelectronic semiconductor chips. |
申请公布号 |
WO2015055646(A2) |
申请公布日期 |
2015.04.23 |
申请号 |
WO2014EP72007 |
申请日期 |
2014.10.14 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
PINDL, MARKUS;JEREBIC, SIMON;GELTL, TOBIAS |
分类号 |
H01L33/54 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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