| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which can make position accuracy of a copper connector in solder connection be good after ensuring self-standing capabilities of the copper connector in solder mounting by performing solder mounting to connect electrodes of a bare-chip transistor and wiring patterns on a substrate by using the copper connector.SOLUTION: A semiconductor module 30 comprises copper connectors 36a, 36b for connecting electrodes S, G formed on a top face of a bare-chip transistor 35 on wiring patterns 33b, 33c of a plurality of wiring patterns 33a-33d via solders 34b, 34c. The copper connector 36b includes an electrode connection part 36bb connected to the electrode G of the bare-chip transistor and a substrate connection part 36bc which is arranged so as to face the electrode connection part 36bb and connected to the wiring pattern 33c. A width W1 of the electrode connection part 36bb in a direction orthogonal to one direction is narrower than a width W2 of the substrate connection part 36b in the direction orthogonal to the one direction. |
