| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, and to provide a semiconductor device obtained by sealing a semiconductor element with a cured product of the semiconductor sealing resin composition.SOLUTION: The semiconductor sealing resin composition of the present invention contains a maleimide compound represented by general formula (1), at least one of isocyanuric compounds represented by formula (2-1) and formula (2-2), an aromatic diamine, an imidazole compound, and an organic peroxide. In the general formula (1), X represents a C1-C10 alkylene group, an oxygen atom, or a single bond.</p> |
