发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device having high breakdown voltage and low on-resistance.SOLUTION: A semiconductor device comprises: a G insulating film on a substrate; a G electrode on the G insulating film; a p-type channel region under a gate electrode; n-type S and D regions on both sides of the channel region; a p-type well 1 which is disposed under the S region and has an end 1 on the D region side under the gate electrode and which extends from the end 1 to the S region side; a p-type well 2 which is disposed under the D region and connected to the well 1 and which has an end 2 at a same position as the end 1 or on the S region side with respect to the end 1 and which extends from the end 2 to the D region side; a p-type well 3 which is disposed between the D region and the well 2 and has a lower impurity concentration than the well 2; and an n-type well 4 surrounding the well 1 and the well 2. The upper side of the well 2 is positioned under the upper side of the well 1 and above the lower side of the well 1. The lower side of the well 2 is positioned under the well 1.</p> |
申请公布号 |
JP2015079919(A) |
申请公布日期 |
2015.04.23 |
申请号 |
JP20130217727 |
申请日期 |
2013.10.18 |
申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
SHIMA MASASHI |
分类号 |
H01L21/336;H01L21/8234;H01L27/08;H01L27/088;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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