发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor device having high breakdown voltage and low on-resistance.SOLUTION: A semiconductor device comprises: a G insulating film on a substrate; a G electrode on the G insulating film; a p-type channel region under a gate electrode; n-type S and D regions on both sides of the channel region; a p-type well 1 which is disposed under the S region and has an end 1 on the D region side under the gate electrode and which extends from the end 1 to the S region side; a p-type well 2 which is disposed under the D region and connected to the well 1 and which has an end 2 at a same position as the end 1 or on the S region side with respect to the end 1 and which extends from the end 2 to the D region side; a p-type well 3 which is disposed between the D region and the well 2 and has a lower impurity concentration than the well 2; and an n-type well 4 surrounding the well 1 and the well 2. The upper side of the well 2 is positioned under the upper side of the well 1 and above the lower side of the well 1. The lower side of the well 2 is positioned under the well 1.</p>
申请公布号 JP2015079919(A) 申请公布日期 2015.04.23
申请号 JP20130217727 申请日期 2013.10.18
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 SHIMA MASASHI
分类号 H01L21/336;H01L21/8234;H01L27/08;H01L27/088;H01L29/78 主分类号 H01L21/336
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