Method for Forming Semiconductor Device Package with Slanting Structures

摘要

A method for forming semiconductor device package comprises providing a substrate with via contact pads and via through holes through said substrate, terminal pads on a bottom surface of said substrate and an exposed type through hole through said substrate. A die is provided with bonding pads thereon and an exposed type pad on a bottom surface of said die. A reflective layer is formed on an upper surface of the substrate. The die is adhered on the substrate. A dry film is formed on a top of the die as a slanting structure. A re-distribution layer conductive trace is formed by sputtering and E-plating on an upper surface of the slanting structure.

主权项

1. A method for forming semiconductor device package, comprising:
providing a substrate with via contact pads and via through holes through said substrate, terminal pads on a bottom surface of said substrate and an exposed type through hole through said substrate; providing a die having bonding pads thereon and an exposed type pad on a bottom surface of said die, wherein said exposed type pad is aligned with said exposed type through hole, wherein said die is formed on a top surface of said substrate; forming a reflective layer on an upper surface of said substrate; adhering said die on said substrate; forming a dry film on a top of said die under a vacuum 1E-1 to 1E-2 ton and a temperature condition 70 to 110 centigrade, said dry film with the elastic property flowing to an edge of said die to fill out the slope area adjacent to said die to form a slanting structure; and forming a re-distribution layer conductive trace by sputtering and E-plating on an upper surface of said slanting structure to offer path between said bonding pads of said die and said via contact pads of said substrate.