发明名称 SILICON CARBIDE EPITAXIAL WAFER, AND PREPARATION METHOD THEREOF
摘要 According to an embodiment, there is provided a method of fabricating an epitaxial wafer, which includes preparing a wafer in a susceptor; and growing an epitaxial layer on the wafer, wherein the growing of the epitaxial layer on the wafer includes supplying a raw material into the susceptor; growing the epitaxial layer on the wafer at a first growth rate; and growing the epitaxial layer on the wafer at a second growth rate higher than the first growth rate. According to an embodiment, there is provided a silicon carbide epitaxial wafer which includes a silicon carbide wafer; and a silicon carbide epitaxial layer on the silicon carbide wafer wherein a surface defect formed on the silicon carbide epitaxial layer is 1 ea/cm2 or less.
申请公布号 US2015108493(A1) 申请公布日期 2015.04.23
申请号 US201314404374 申请日期 2013.05.28
申请人 LG INNOTEK CO., LTD. 发明人 Kang Seok Min
分类号 H01L21/02;H01L29/16 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of fabricating an epitaxial wafer, the method comprising: preparing a wafer in a susceptor; and growing a-silicon-cubicle an epitaxial layer on the wafer, wherein the growing of the epitaxial layer on the wafer comprises: supplying a raw material into the susceptor; growing the epitaxial layer on the wafer at a first growth rate; and growing the epitaxial layer on the wafer at a second growth rate higher than the first growth rate.
地址 Seoul KR
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