发明名称 MOLTEN METAL PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a molten metal plating device which prevents adhesion of plating metal splash to a steel strip after wiping, and which dissolves complex maintenance regarding production facility.SOLUTION: The device includes: a plating bath; a wiping nozzle for adjusting a metal adhesion amount by dropping excessive plating metal adhered to the steel strip by injecting gas to the surface of the steel strip continuously drawn from the plating bath; and an over-bath support roll provided above the wiping nozzle, which vertically supports the steel strip continuously drawn from the plating bath. Moreover the device includes: a distributor arranged under the wiping nozzle and above the plating bath; and a shield net which is arranged vertically from above the position of the wiping nozzle, to the position of the distributor, and which does not contact the wiping nozzle.
申请公布号 JP2015078405(A) 申请公布日期 2015.04.23
申请号 JP20130215292 申请日期 2013.10.16
申请人 JFE STEEL CORP 发明人 IWANE KEISUKE
分类号 C23C2/00;C23C2/16 主分类号 C23C2/00
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