JOINING SILVER SHEET, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR JOINING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a joining silver sheet capable of obtaining high joining strength at low pressure of 3 MPa or less.SOLUTION: A joining silver sheet is configured such that silver particles having a particle diameter of 1-250 nm are integrated through sintering, and the joining silver sheet is of such a nature that the sintering progresses when the joining silver sheet is heated to and held at a temperature of Tto T(°C) satisfying the relation 270≤T