发明名称 LIGHT EMITTING DIODE FABRICATION METHOD
摘要 A fabrication method for a light emitting diode (LED), including: 1) mounting a LED chip on a substrate; 2) mounting a screen printing template on the LED chip; 3) coating a silicone gel layer over the surface of the screen printing template; 4) printing the phosphor: printing the phosphor over the chip surface via silk screen printing process and recycling the excess phosphor; and 5) removing the screen printing template and baking the phosphor for curing, and coating the cured phosphor over the chip surface. In the packaging method of the present disclosure, the unused phosphor can be recycled because it is not polluted by the screen printing template material.
申请公布号 US2015111328(A1) 申请公布日期 2015.04.23
申请号 US201414588395 申请日期 2014.12.31
申请人 XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 HUANG YI-JUI;LIN KECHUANG;LIN SUHUI;ZHUO JIALI
分类号 H01L33/50;H01L33/54 主分类号 H01L33/50
代理机构 代理人
主权项 1. A fabrication method for a light emitting diode (LED), comprising: Step 1) selecting a screen printing template and coating a protection layer over a surface of the screen printing template; Step 2) mounting a LED chip on a substrate; Step 3) mounting the screen printing template on the LED chip; Step 4) printing a phosphor over a surface of the LED chip via a screen printing process and recycling excess phosphor; and Step 5) baking the phosphor for curing, separating the LED chip from the screen printing template, and coating the cured phosphor over the surface of the LED chip.
地址 Xiamen CN
您可能感兴趣的专利