发明名称 FLAME-RETARDANT POLY LACTIC ACID-CONTAINING FILM OR SHEET, AND METHOD FOR MANUFACTURING THEREOF
摘要 A film or sheet composed of a resin composition including a poly lactic acid (A), an acidic functional group-modified olefinic polymer (B) including an acidic functional group and having an acid value of 10 to 70 mg KOH/g and a weight average molecular weight of 10,000 to 80,000, a tetrafluoroethylene polymer (C), and an aromatic cyclic phosphazene-containing flame retardant (D) including a compound of Formula (I) and in (D) is included in an amount of 10 to 70 parts by weight based on 100 parts by weight of (A), and a method for manufacturing the film or sheet by melt film formation.;
申请公布号 US2015108679(A1) 申请公布日期 2015.04.23
申请号 US201414581020 申请日期 2014.12.23
申请人 NITTO DENKO CORPORATION 发明人 SENDA Hiroki;ISHIGURO Shigeki
分类号 C08J5/18;B29C43/24;B29C43/00 主分类号 C08J5/18
代理机构 代理人
主权项 1. A method for manufacturing the film or sheet, comprising forming a film from a resin composition by melt film formation, the resin composition comprising: a poly lactic acid (A); an acidic functional group-modified olefinic polymer (B) including an acidic functional group and having an acid value of 10 to 70 mg KOH/g and a weight average molecular weight of 10,000 to 80,000; a tetrafluoroethylene polymer (C); and an aromatic cyclic phosphazene-containing flame retardant (D) including a compound of General Formula (I), the aromatic cyclic phosphazene-containing flame retardant (D) being included in an amount of 10 to 70 parts by weight based on 100 parts by weight of the poly lactic acid (A), (where each of A1 and A2 is independently an aryl group having 6 to 10 carbon atoms optionally substituted with 1 to 4 alkyl groups having 1 to 4 carbon atoms; andn is an integer of 3 to 6), the resin composition during the melt film formation having a temperature between a temperature 15° C. higher than a crystallization temperature (Tc) of the resin composition in a temperature drop process and a temperature 5° C. lower than a melting temperature (Tm) in a temperature rise process or the melt film formed resin composition being cooled and solidified after a crystallization accelerating step between a temperature 25° C. lower than a crystallization temperature (Tc) of the resin composition in a temperature drop process and a temperature 10° C. higher than the crystallization temperature (Tc).
地址 Osaka JP