| 发明名称 |
Thinning in package using separation structure as stop |
| 摘要 |
A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop. |
| 申请公布号 |
US2015108666(A1) |
申请公布日期 |
2015.04.23 |
| 申请号 |
US201314058213 |
申请日期 |
2013.10.18 |
| 申请人 |
Infineon Technologies AG |
发明人 |
ENGELHARDT Manfred;Fuergut Edward;Eder Hannes |
| 分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a thinned encapsulated chip structure, the method comprising:
providing a separation structure arranged within an electronic chip; encapsulating part of the electronic chip by an encapsulating structure; thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop. |
| 地址 |
Neubiberg DE |
