| 发明名称 |
STRUCTURE TO PREVENT SOLDER EXTRUSION |
| 摘要 |
A spacer structure formed adjacent a solder connection which prevents solder extrusion and methods of manufacture are disclosed. The method includes forming a solder preform connection on a bond pad of a chip. The method further includes forming a spacer structure on sidewalls of the solder preform connection. The method further includes subjecting the solder preform connection to a predetermined temperature to form a solder connection with the spacer structure remaining thereabout. |
| 申请公布号 |
US2015108642(A1) |
申请公布日期 |
2015.04.23 |
| 申请号 |
US201314057649 |
申请日期 |
2013.10.18 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Daubenspeck Timothy H.;Gambino Jeffrey P.;Muzzy Christopher D.;Sauter Wolfgang;Sullivan Timothy D. |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
forming a solder preform connection on a bond pad of a chip; forming a spacer structure on sidewalls of the solder preform connection; and subjecting the solder preform connection to a predetermined temperature to form a solder bump, with the spacer structure remaining thereabout. |
| 地址 |
Armonk NY US |
