LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package includes a lead frame, a light emitting diode chip, a wavelength conversion structure, and a filter. The light emitting diode chip is disposed on and electrically connected to the lead frame for providing a first light beam with a first wavelength. The light emitting diode chip is configured to provide a first light beam with a first wavelength. The wavelength conversion structure is disposed on the light emitting diode chip, and is configured to convert the first light beam into a second light beam with a second wavelength. The filter is disposed between the light emitting diode chip and the wavelength conversion structure. The filter allows the first light beam from the light emitting diode chip to pass therethrough to enter the wavelength conversion structure, and reflects the second light beam from the wavelength conversion structure back to the wavelength conversion structure.

主权项

1. A light emitting diode package, comprising:
a lead frame; a light emitting diode chip disposed on and electrically connected to the lead frame for providing a first light beam with a first wavelength; a wavelength conversion structure disposed on the light emitting diode chip for converting the first light beam into a second light beam with a second wavelength; and a filter disposed between the light emitting diode chip and the wavelength conversion structure for allowing the first light beam from the light emitting diode chip to pass therethrough to enter the wavelength conversion structure, and reflecting the second light beam from the wavelength conversion structure back to the wavelength conversion structure.