| 主权项 |
1. A substrate treatment system comprising:
a substrate transfer chamber for transferring a substrate to a chamber provided therearound; a load lock chamber disposed on an atmosphere side of the substrate transfer chamber and hermetically connected to the substrate transfer chamber; and a plurality of substrate treatment apparatuses provided around the substrate transfer chamber and hermetically connected to the substrate transfer chamber, wherein at least one of the substrate treatment apparatuses is a plasma treatment apparatus, and the plasma treatment apparatus is further hermetically connected to a first substrate treatment apparatus different from the plurality of substrate treatment apparatuses, wherein the plasma treatment apparatus includes: a treatment chamber, a first substrate holder for holding the substrate provided in the treatment chamber, a plasma generation unit for forming plasma in the treatment chamber, a first gate valve for carrying the substrate into and out of the treatment chamber from the substrate transfer chamber, a second gate valve for carrying the substrate into and out of the first substrate treatment apparatus from the treatment chamber, a substrate transfer unit, provided in the treatment chamber, for transferring the substrate inside the treatment chamber and performing at least one of installation and removal of the substrate into and from the treatment chamber through the second gate valve, and a shield for surrounding the plasma formed by the plasma generation unit, the shield being provided so as to shield the substrate transfer unit from the plasma. |
