Copper Bump Structures Having Sidewall Protection Layers

摘要

A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection

主权项

1. A method comprising:
forming a polymer layer on sidewalls of a conductive bump disposed on a first work piece, the conductive bump comprising a first metal and the polymer layer comprising a polymer material; and forming a protection layer on the sidewalls by curing the polymer layer, wherein the protection layer is a dielectric comprising a compound of the first metal and the polymer material; wherein the conductive bump extends below a bottommost surface of the protection layer; and wherein the protection layer covers the sidewalls of the conductive bump above the work piece, a top surface of the conductive bump being exposed through the protection layer.