SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

Provided is a semiconductor package in which a cell array region and a peripheral circuit region are formed as different semiconductor chips, respectively. First semiconductor chips including memory cells and a second semiconductor chip including only peripheral circuitry common to the first semiconductor chips are electrically connected to each other. Thus, a loading capacitance of the semiconductor package may be reduced. As a result, an RC delay of the semiconductor package may be reduced, thereby improving an operating speed of the semiconductor package.

主权项

1. A semiconductor package comprising:
a package substrate; a first semiconductor chip at a central region of the package substrate, the first semiconductor chip including a peripheral circuit region having peripheral circuits; and second semiconductor chips on the package substrate at both sides of the first semiconductor chip, each of the second semiconductor chips including a cell array region in which memory cells are disposed, the peripheral circuits in the first semiconductor chip configured to drive the memory cells in the second semiconductor chips.