LIGHT EMITTING DIODE PACKAGE STRUCTURE AND LIGHT EMITTING DIODE PACKAGE MODULE

摘要

A light emitting diode package structure includes a substrate, a light emitting diode chip, a light mixing encapsulating layer, and an ultraviolet protecting layer. The light emitting diode chip is disposed on a surface of the substrate and the light mixing encapsulating layer covers the light emitting diode chip. The ultraviolet protecting layer is adhered to a surface of the light mixing encapsulating layer such that when the ultraviolet protecting layer receives ultraviolet, the color change occurs to reflect or absorb the ultraviolet.

主权项

1. A light emitting diode package structure, comprising:
a substrate; a light emitting diode chip emitting a light of first wavelength and disposed on a surface of the substrate; a light mixing encapsulating layer covering the light emitting diode chip, the light mixing encapsulating layer having a wavelength conversion material to convert part of the light of first wavelength to a light of second wavelength, and mix with the light of first wavelength that is not converted to the second wavelength to form a white light; and an ultraviolet protecting layer adhered to a surface of the light mixing encapsulating layer; when the ultraviolet protecting layer receives a light of ultraviolet band, color change occurs in the ultraviolet protecting layer to reflect or absorb the light of the ultraviolet band.