SINGULATING HYBRID INTEGRATED PHOTONIC CHIPS

摘要

During a fabrication technique, trenches are defined partially through the thickness of a substrate. Then, photonic integrated circuits are coupled to the substrate. These photonic integrated circuits may be in a diving-board configuration, so that they at least partially overlap the trenches. While this may preclude the use of existing dicing techniques, individual hybrid integrated photonic chips (which each include a portion of the substrate and at least one of the photonic integrated circuits) may be singulated from the substrate by: coupling a carrier to a front surface of the substrate; thinning the substrate from a back surface until the partial trenches are reached (for example, by grinding the substrate); attaching a support mechanism (such as tape) to the back surface of the substrate; removing the carrier; and then removing the support mechanism.

主权项

1. A method for singulating hybrid integrated photonic chips, wherein the method comprises:
defining trenches from a front surface of a substrate extending partially through a thickness of the substrate; coupling photonic integrated circuits to the substrate, wherein a given photonic integrated circuit has a front surface facing the front surface of the substrate, andwherein the given photonic circuit at least partially overlaps a given trench;
coupling a carrier to the front surface of the substrate; reducing the thickness of the substrate from a back surface of the substrate; coupling a support mechanism to the back surface of the substrate; removing the carrier from the front surface of the substrate; and singulating the hybrid integrated photonic chips by removing the support mechanism from the back surface of the substrate, wherein a given hybrid integrated photonic chip includes a portion of the substrate and one of the photonic integrated circuits.