| 摘要 |
Water-path-forming bodies for mounting on semiconductor power modules and heat sinks for power modules have a heat transfer portion which has an extremely complex structure in order to increase thermal conductivity, and highly advanced techniques and high costs are required to produce such products. A slit-and-stretched sheet (13) is provided in a channel (12) formed between two flat surfaces (11, 11) disposed so as to face each other. Localized fluid flows (16) guided by the slit-and-stretched sheet (13) are caused to act on a variety of boundary layers (15) formed between the two flat surfaces (11, 11) and a fluid, and the flow characteristics of the fluid pertaining to heat transfer and/or material transfer are improved by a localized turbulence-promoting action. |
