| 摘要 |
<p>Conventionally, when a heat-siphon-type ebullient cooling device is mounted at a high density on a circuit board of an electronic device such as a 1U server or a 2U server, it is not possible to cause condensed coolant to reflux in a stable manner from a heat dissipation unit (condensing unit) to heat-receiving units (boiling units) of the heat siphon, preventing the boiling and condensation heat transfer in the heat siphon from being maintained in a stable manner and making it difficult to obtain a high cooling performance. This ebullient cooling device is characterized in that: the ebullient cooling device is provided with two heat-receiving units (boiling units) for receiving heat from a heat-generating element such as a central processing unit (CPU) mounted on a circuit board provided in an electronic device such as a server and thereby causing a coolant filling the interior of the device to boil and generate vapor, a heat dissipation unit (condensing unit) for cooling and condensing the coolant vapor generated in the heat-receiving units, and single tubes linking the two heat-receiving units and the heat dissipation unit to each other; the single tube that links the heat dissipation unit with the heat-receiving unit, from among the two heat-receiving units, that is disposed further from the heat dissipation unit penetrates the inside of the tube that links the heat dissipation unit with the heat-receiving unit, from among the two heat-receiving units, that is disposed nearer the heat dissipation unit, whereby the tube that links the heat dissipation unit with the heat-receiving unit, from among the two heat-receiving units, that is disposed nearer the heat dissipation unit has a double-tube structure in which an outer tube and an inner tube having different outer diameters are concentrically combined; and a condensing space for causing the coolant vapor to condense in the heat dissipation unit is provided to each of the inner tube and the outer tube of the double tube.</p> |
