发明名称 Thermal management for lighting devices
摘要 A lighting system (7500) comprises an electrical facility for powering a LED light. The LED light comprises LEDs (7112), a circuit board (7114) and a back plate (7110) The back plate (7110) is thermally associated with a thermally conductive housing (7518) and an inner surface (7518) of a thermal transfer facility (7502) is thermally associated with the thermally conductive housing (7512) when the LED light is associated with the electrical facility.
申请公布号 EP2572932(B1) 申请公布日期 2015.04.22
申请号 EP20120198393 申请日期 2004.12.13
申请人 PHILIPS SOLID-STATE LIGHTING SOLUTIONS, INC. 发明人 NORTRUP, EDWARD;MUELLER, GEORGE, G.;MORGAN, FREDERICK, M.;LYS, IHOR, A.;DOWLING, KEVIN, J.
分类号 B60Q1/06;B60Q1/26;F21K99/00;F21S8/00;F21V19/00;F21V21/00;F21V23/04;F21V29/00;F21V29/02;F21Y101/02;H05B 主分类号 B60Q1/06
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