| 摘要 |
Provided is a semiconductor package with minimized volume and high capacity of the semiconductor package. The semiconductor package according to the present invention comprises a package base substrate having a bonding pad; a semiconductor substrate having an active surface and an inactive surface opposite to each other; a semiconductor device formed on the active surface of the semiconductor substrate; a first pad electrically connected to the semiconductor device; a conductive pattern having the same level with the first pad for the semiconductor substrate, and being nearer to the edge of the semiconductor substrate than the first pad; and a second pad connected on the first pad and extended on the conductive pattern to be separated from the conductive pattern respectively, and comprises multiple semiconductor chip shifted in a certain distance in the first direction for at least one part of the second pad to be exposed, and laminated on a package base substrate, and a bonding wire connecting the second pad and the bonding pad of each of multiple semiconductor chips. |
