| 摘要 |
<p>The idea of the present invention provides a printed circuit board (PCB) including a metal layer and a semiconductor package including the same, capable of improving the reliability of the package and the PCB and preventing a wiring part formed on the PCB from being oxidized and contaminated by covering the wiring part on the PCB with the metal layer. The PCB includes: an insulation layer with a planar structure which includes a bottom side and a top side, the wiring part which is formed at least on the top side or the bottom side of the insulation layer and includes a plurality of wiring patterns, and the metal layer which covers the wiring part with the wiring patterns. Also, the semiconductor package includes the PCB which includes the metal layer to cover the wiring part with the wiring patterns, a semiconductor chip which is mounted at least on the top side or the bottom side of the PCB with a wiring bonding or a flip-chip bonding, and a molding member which covers the top side or the bottom side of the PCB.</p> |
