| 摘要 |
<p>Disclosed is an apparatus for assembling a heat sink and an IC. The apparatus for assembling the heat sink and the IC according to one embodiment of the present invention includes a working lane which forms a line to assemble the heat sink and the integrated circuit (IC), a heat sink supply unit which is arranged on one side of the work lane and supplies the heat sink to the work lane, an IC supply unit which is arranged independently of the heat sink supply unit and supplies the IC to mount the IC on the upper side of the heat sink, an assembly unit which assembles the heat sink and the IC, and a heat sink centering and transferring unit which is arranged on one side of the work lane, centers the heat sink supplied to the work lane, and transfers the heat sink on the IC mounting position and the IC assembling position.</p> |
