| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin burr removing method of a semiconductor device capable of economically manufacturing products having a good quality in a shorter time than that in the past.SOLUTION: In a method of removing a resin burr 13 adhered to the rear surface of a die pad 10 from a semiconductor device 12 in which the die pad 10 is exposed on the rear surface of a package 11, the rear surface side of the die pad 10 to which the resin burr 13 is adhered is irradiated with a laser, the resin burr 13 is removed by electrolytic degreasing after carbonizing the resin burr 13. The irradiation range of the laser is 80% or more and 120% or less of the size of the die pad 10. |
