| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat radiation structure of an electronic device capable of radiating heat of an electronic component with efficiency. <P>SOLUTION: A power transformer 3 is mounted on a substrate 2. A heat radiation sheet 5 is provided on a ferrite core 4 of the power transformer 3. A heat transfer cooling plate 6 is provided on the heat radiation sheet 5 while being tightly adhered to the heat radiation sheet 5. Heat generated in the power transformer 3 is transferred to the heat transfer cooling plate 6 through the ferrite core 4 and the heat radiation sheet 5, and radiated from the heat transfer cooling plate 6 to the interior of a housing of an electronic device. The heat transfer cooling plate 6 is bent at a right angle at a position of contacting with a case 1 (the device housing) and tightly fixed to the case 1. The heat generated in the power transformer 3 is transferred from the heat transfer cooling plate 6 to the case 1, and radiated from the case 1 to the exterior of the electronic device. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
