| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure which can enhance conduction reliability between electrodes. <P>SOLUTION: The method of manufacturing a connection structure 1 according to the present invention includes the steps of: placing an anisotropic conductive material layer 3A on a first connection target member 2 having an electrode 2b on the top surface 2a thereof; B-staging the anisotropic conductive material layer 3A by irradiating the anisotropic conductive material layer 3A with light to promote curing of the anisotropic conductive material layer 3A; and further laminating a second connection target member 4 having an electrode 4b on the undersurface 4a thereof on the top surface 3a of a B-staged anisotropic conductive material layer 3B. When the anisotropic conductive material layer 3A is B-staged, the curing rate of an anisotropic conductive material layer portion 3Ba in a region of a half thickness of one surface side 3a and a curing rate of an anisotropic conductive material layer portion 3Bb in a region of a half thickness of the other surface side 3b are controlled to have a specific relation. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
