| 发明名称 |
Organic solderability preservative and method |
| 摘要 |
<p>An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.</p> |
| 申请公布号 |
EP2746427(B1) |
申请公布日期 |
2015.04.22 |
| 申请号 |
EP20130197964 |
申请日期 |
2013.12.18 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
TANG, QIN;TONG, KIT HO;CHAN, CHIT YIU;BAYES, MARTIN W. |
| 分类号 |
C23C22/52;C23F11/08;C23F11/14;H05K3/28 |
主分类号 |
C23C22/52 |
| 代理机构 |
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