| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dicing tape integrated type wafer rear surface protection film which is used from a dicing step of a semiconductor wafer through a flip chip bonding step of a semiconductor chip. <P>SOLUTION: A manufacturing method of a semiconductor device using a dicing tape integrated type wafer rear surface protection film having a dicing tape and a wafer rear surface protection film includes the steps of: bonding a work piece on the wafer rear surface protection film which is colored; dicing the work piece to form chip like work pieces; peeling the chip like work pieces from an adhesive layer of the dicing tape with the wafer rear surface protection film; and fixing the chip like work piece to an adherend by a flip chip bonding method. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
