| 摘要 |
The invention relates to an array (1) formed from a multiplicity of electric integrated circuits (1a), comprising a conductive connection, extending over all integrated circuits of the array, to a central contact path for bond monitoring, wherein a separation region (2) is provided in each case between adjacent integrated circuits (1a) and a separation from the array (1) is implemented along the separation region in order to separate the integrated circuits (1a). In order to avoid corrosion of electric circuits (1a) produced from the array (1), at least one conductive connection portion (3) is provided and extends between two contact paths (4), which enclose the separation region (2) and are arranged adjacent thereto, wherein the conductive connection portion (3) is formed by inert material. The invention also relates to a corresponding electric integrated circuit (1a) and also to production methods for producing an array (1) of this type and for producing an electric integrated circuit (1a) of this type. |
