| 摘要 |
<p>The present invention relates to a semiconductor device to remove command bubble generated when switching rank to rank if chips are arranged in layers by using Through Silicon Via (TSV). The present invention comprises: a first memory; a second memory arranged on an upper part of the first memory, and inputting and outputting data through TSV; and a mediator formed inside the first memory, arbitrating a first data applied from the first memory and a second data applied from the second memory through TSV, and providing the same to an input-output pad.</p> |
