| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package, a package manufacturing method and a piezoelectric vibrator, capable of suppressing a manufacturing failure at mounting with a secured wide interval between external electrodes. <P>SOLUTION: In a piezoelectric vibrator 1 (package), capable of encapsulating a piezoelectric vibration piece 4 (electronic component) in a cavity 16 formed between a plurality of mutually joint substrates, there are provided a plurality of penetration electrodes 34, 35 which penetrate through a base substrate 2 (first substrate) out of the plurality of substrates in a thickness direction, and conduct the inside of the base substrate 2 to external electrodes 21, 22 disposed outside the base substrate 2. Each penetration electrode 34, 35 is formed such that an inter-electrode pitch exposed to the external electrode 21, 22 side of the base substrate 2 is larger than an inter-electrode pitch exposed inside the base substrate 2. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
