| 摘要 |
<p>The invention relates to a heat treatment device (1), optionally with a downstream hot-forming device (15), comprising at least a first heat station (12), a second downstream heat station (12), optionally one or more further downstream heat station(s) (14), a transfer device for supplying and/or discharging the workpieces (11) to and/or from the heat stations (12-14), and a control device for operating the transfer device and/or the heat stations (12-14). The first heat station (12) is designed in such a manner that the workpiece(s) (11) received therein is/are or can be heated to a predefined first temperature within a predetermined first dwell time. The at least second heat station (13) comprises more workpiece receiving spaces (13a) than the at least first heat station (12) and is designed in such a manner that the workpieces (11) received therein can be in each case heated within a certain second dwell time, which is greater than the first dwell time in the first heat station (12), to a predefined second temperature and/or can be constantly maintained at said predefined second temperature, wherein the predefined second temperature in the second heat station (13) is approximately equal to or higher than the predefined first temperature in the first heat station (12). The invention further relates to a heat treatment method.</p> |
