| 摘要 |
<p>An electronic assembly for an inverter comprises a substrate 34 having a dielectric layer 54 and metallic circuit traces. A plurality of terminals 36-44 are arranged for connection to a direct current source. A first semiconductor 20 and a second semiconductor 22 are coupled together between the terminals of the direct current source. A metallic island (e.g., strip) is located in between the mount connectors. The metallic island provides a heat sink to radiate heat. The device may have a first enclosure portion mounted above the substrate and a second enclosure portion mounted below the substrate, wherein the first enclosure portion has a plurality of coolant channels. The heat may be conducted away from the islands through vias. The connectors may be mounted on the substrate and the enclosure may have an inner surface with a mating shape and size that corresponds with the connector.</p> |
