Method of manufacturing a semiconductor fin using sacrificial layer

摘要

The present invention provides a method for manufacturing a semiconductor structure, comprising the steps of: providing a semiconductor substrate, forming an insulating layer on the semiconductor substrate, and forming a semiconductor base layer on the insulating layer; forming a sacrificial layer and a spacer surrounding the sacrificial layer on the semiconductor base layer, and etching the semiconductor base layer by taking the spacer as a mask to form a semiconductor body; forming an insulating film on sidewalls of the semiconductor body; removing the sacrificial layer and the semiconductor body located under the sacrificial layer to form a first semiconductor fin and a second semiconductor fin. Correspondingly, the present invention further provides a semiconductor structure. In the present invention, an oxide film is formed on the sidewalls of the two semiconductor fins that are far away from each other, while only the sidewalls of the two semiconductor fins that are opposite to each other are exposed, such that conventional operations may be easily performed to the sidewalls opposite to each other in the subsequent process.

主权项

1. A method for manufacturing a semiconductor structure, comprising:
a) providing a semiconductor substrate (100), forming an insulating layer (101) on the semiconductor substrate (100), and forming a semiconductor base layer (102) on the insulating layer (101); b) forming a sacrificial layer (200) and a spacer (201) surrounding the sacrificial layer (200) on the semiconductor base layer (102), and etching the semiconductor base layer (102) by taking the spacer (201) and the sacrificial layer (200) as a mask to form a semiconductor body (103); c) after etching the semiconductor base layer (102), forming an insulating film (300) on sidewalls of the semiconductor body (103); and d) after forming the insulating film (300), removing the sacrificial layer (200) and the semiconductor body (103) located under the sacrificial layer (200) to form a first semiconductor fin (210) and a second semiconductor fin (220), wherein the first semiconductor fin (210) and the second semiconductor fin (220) respectively have a first sidewall with the insulating film (300) thereon and a second exposed sidewall.