发明名称 |
Packaged device exposed to environmental air and liquids and manufacturing method thereof |
摘要 |
A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids. |
申请公布号 |
US9011776(B2) |
申请公布日期 |
2015.04.21 |
申请号 |
US201314013730 |
申请日期 |
2013.08.29 |
申请人 |
STMicoroelectronics S.r.l. |
发明人 |
Ziglioli Federico Giovanni;Fontana Fulvio Vittorio;Maggi Luca |
分类号 |
B81C1/00;B81B7/00;H04R19/04 |
主分类号 |
B81C1/00 |
代理机构 |
Seed IP Law Group PLLC |
代理人 |
Seed IP Law Group PLLC |
主权项 |
1. A packaged device, comprising:
a chip; and a package body delimiting a chamber, at least a portion of the chip being located in the chamber, the package body including a plurality of holes that enable passage of air between an external environment and the chamber, the package body including an outer surface having a surface roughness that is configured to block passage of liquids through the plurality of holes. |
地址 |
Agrate Brianza IT |