| 摘要 |
<p>According to an embodiment of the present invention, disclosed are a laser processing apparatus and a processing method using the same, comprising steps of: forming an n^th groove (n is a natural number of one or more) of which floor surface is flat by injecting laser light into a substrate; moving the depth of a focus of the laser light in the thickness direction of the substrate; and forming an (n+1)^th groove of which floor surface is flat and which is superposed with the n^th groove by injecting the laser light of which the depth of a focus is moved.</p> |
