| 主权项 |
1. An electronic device, comprising:
a housing; a heat source located in the housing; and a heat dissipation device disposed in the housing, the heat dissipation device and the heat source being kept apart from each other at a distance, the heat dissipation device comprising a casing and a heat dissipation material disposed in the casing, the heat dissipation material comprising 15 to 30 percent volume of a plurality of copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air, wherein the phase change material comprises an alkane; wherein the casing has a surface facing the heat source, a central area and an outer ring area are defined on the surface, the outer ring area surrounds the central area, a geometric midpoint of the central area and a geometric midpoint of the surface overlap, the area of the central area is 10 percent to 50 percent of the area of the surface, an orthographic projection of the heat source to the surface forms an orthographic projection region located in the central area, and the heat dissipation device absorbs heat generated by the heat source through thermal radiation. |
