| 发明名称 | Semiconductor device | ||
| 摘要 | A semiconductor device includes a semiconductor element, a capacitor, a first resin, lead frames and a second resin. The first resin forms a resin molding which covers the semiconductor element and the capacitor. The lead frames are attached to two surfaces of the resin molding and are connected to the semiconductor element and the capacitor. The second resin directly covers the capacitor and has a rigidity lower than a rigidity of the first resin. An outside of the second resin is directly covered with the first resin. | ||
| 申请公布号 | US9013047(B2) | 申请公布日期 | 2015.04.21 |
| 申请号 | US201314056148 | 申请日期 | 2013.10.17 |
| 申请人 | Toyota Jidosha Kabushiki Kaisha | 发明人 | Imai Makoto;Tanaka Toru |
| 分类号 | H01L23/495;H01L23/00;H01L23/31 | 主分类号 | H01L23/495 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A semiconductor device comprising: a semiconductor element; a capacitor; a first resin that forms a resin molding which covers the semiconductor element and the capacitor; and lead frames that are attached to two surfaces of the resin molding and that are connected to the semiconductor element and the capacitor, a second resin that directly covers the capacitor and that has a rigidity lower than a rigidity of the first resin, wherein an outside of the second resin is directly covered with the first resin. | ||
| 地址 | Toyota-shi JP | ||