| 发明名称 |
High pin count, small SON/QFN packages |
| 摘要 |
A plastic SON/QFN package for high power has a pair of oblong metal pins exposed from a surface of the plastic, the pins straddling a corner of the package; each pin has a long axis, the long axes of the pair forming a non-orthogonal angle. |
| 申请公布号 |
US9013032(B2) |
申请公布日期 |
2015.04.21 |
| 申请号 |
US201414451979 |
申请日期 |
2014.08.05 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Koduri Sreenivasan K. |
| 分类号 |
H01L23/48;H05K1/11;H01L23/495;H01L23/34;H05K1/02 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
Shaw Steven A.;Cimino Frank D. |
| 主权项 |
1. A plastic SON/QFN package comprising:
metal pins exposed from a surface of the plastic, the pins arrayed along opposite edges of the package, the package corners occupied by a plurality of pins; and each pin having an axis and a mold lock protruding from the pin, the lock shaped as an elongated beam oriented normal to the axis, the beam interdigitated with a beam of an adjacent pin. |
| 地址 |
Dallas TX US |
