Gas sensor and flip-chip method for its manufacture

摘要

A sensor element is described that includes at least one semiconductor component having a gas-sensitive layer which is attached to a substrate by the flip-chip method, the gas-sensitive layer facing the substrate and a supply arrangement being provided to supply a gas to be examined to the gas-sensitive layer. The semiconductor component is enclosed in a casing. Also described is a method for manufacturing the sensor element, in which a semiconductor component having a gas-sensitive layer is attached by the flip-chip method to a substrate in such a way that the gas-sensitive layer faces the substrate. After that, the casing is applied by a plasma sputtering method, in particular an atmospheric plasma sputtering method. Finally, a use of the sensor element in the exhaust system of an internal combustion engine is also described.

主权项

1. A sensor element, comprising:
a substrate; at least one semiconductor component having a gas-sensitive layer, wherein the gas-sensitive layer faces the substrate; and a supply arrangement including a porous layer to supply a gas to be examined to the gas-sensitive layer; wherein: the at least one semiconductor component is enclosed in a casing; the porous layer is situated between the at least one semiconductor component and the substrate and at least a portion of the porous layer is in contact with the casing, and an area of the porous layer protrudes out of the casing and the area contacts an area not protruding out of the casing, the entire area protruding from the casing being exposed to the gas.